Phone|(03) 571-2121 #31654 & #31676
E-mail|nano@nycu.edu.tw
Address|300新竹市東區大學路1001號(交大光復校區)工程四館106室
Chairman of Department of Microelectronics
Office┃Engineering Building 4, Room 644, Extension 31573
E-mail┃mdker@nycu.edu.tw
Education┃Ph.D. in Electrical Engineering, National Chiao Tung University
Research ┃Integrated Circuits Design, Reliability Design of Integrated Circuits, ESD Protection Design for Microelectronics Systems, Circuits and Systems for Biomedical Applications, Neuromodulation SoC for implantable Medical Applications
Personal Website┃Ming Dou-Ker
Associate Chairman of Department of Microelectronics
Office┃Engineering Building 5, Room 126A Extension 55905
E-mail┃hthsu@nycu.edu.tw
Education┃Ph.D. in Electrical Engineering, University of Maryland, USA
Research┃Design and implementation of RF front-ends for next-generation communication systems, Millimeter wave MMIC circuits, Simulation, modeling and characterization for devices with emerging technologies, High-frequency packaging Antenna designs
Personal Website┃Heng-Tung Hsu
Primary Appointed Full-Time Faculty
Office┃Engineering Building 4, Room 644 Extension 31573
E-mail┃mdker@nycu.edu.tw
Education┃Ph.D. in Electrical Engineering, National Chiao Tung University
Research┃Integrated Circuits Design, Reliability Design of Integrated Circuits, ESD Protection Design for Microelectronics Systems, Circuits and Systems for Biomedical Applications, Neuromodulation SoC for implantable Medical Applications
Primary Appointed Full-Time Faculty
Office┃Microelectronics and Information Research Center, Room 622 Extension 52974
E-mail┃ymli@nycu.edu.tw
Education┃Ph.D. in Materials Science and Engineering, University of California, Los Angeles, U.S.A.
Research┃Nano Device and Process Control, Chip and IC Simulations, CAD Optimization, Computational Science and Engineering
Primary Appointed Full-Time Faculty
Office┃CPT Building, Room 602, Extension 54623
E-mail┃seiji.samukawa.e2@nycu.edu.tw
Education┃Ph.D. in Science and Engineering, Keio University, Japan
Research┃Semiconductor Device and Engineering
Primary Appointed Full-Time Faculty
Office┃Engineering Building 5, Room 126A Extension 55905
E-mail┃hthsu@nycu.edu.tw
Education┃Ph.D. in Electrical Engineering, University of Maryland, U.S.A.
Research┃Design and implementation of RF front-ends for next-generation, communication systems, Millimeter wave MMIC circuits, Simulation, modeling and characterization for devices with emerging technologies, High-frequency packaging, Antenna designs
Office┃CPT Building, Room 613, Extension 31884
E-mail┃gechang@nycu.edu.tw
Education┃Ph.D. in Applied Mechanics, National Taiwan University
Research┃Silicon Photonics, Strained Semiconductor Optoelectronic Devices, Optical Biosensors, and Optical Precision Measurement Technologies and Applications
Primary Appointed Full-Time Faculty
Office┃CPT Building, Room 612, Extension 31695
E-mail┃cywang72@nycu.edu.tw
Education┃Ph.D. in Electrical Engineering, National Chiao Tung University
Research┃Mixed signal neural network circuit design, High accuracy sensor circuit design, Computing in Memory/Sensor
Primary Appointed Full-Time Faculty
Office┃CPT Building, Room 611, Extension 31635
E-mail┃telee@nycu.edu.tw
Education┃Ph.D. in Electrical Engineering, University of Tokyo, Japan
Research┃Stacked Device Integration, Thin Film Transistor Technology, Ferroelectric Non-Volatile Memory, Device Reliability Analysis
joint appointment Faculty
A1
Office┃Engineering Building 4, Room 538, Extension 31849
E-mail┃cylee@nycu.edu.tw
Education┃Ph.D. in Electrical Engineering, Catholic University of Leuven, Belgium
Research┃Integrated Circuits and System Design, Video Communications and High-Speed Networks, and Computer-Aided System Design
joint appointment Faculty
1
Office┃Engineering Building 4, Room 643, Extension 31645
E-mail┃wzchen@nycu.edu.tw
Education┃Ph.D. in Electrical Engineering, National Chiao Tung University
Research┃Mixed-signal Integrated Circuits, High Frequency Circuits, Communication System
joint appointment Faculty
1
Office┃Engineering Building 4, Room 623, Extension 54252
E-mail┃chchien@nycu.edu.tw
Education┃Ph.D. in Electrical Engineering, National Chiao Tung University
Research┃Device Physics, Nano-Device Technology, Nano-Memory Device Technology, ULSI Fabrication, and Device Reliability Analysis
joint appointment Faculty
2
Office┃Engineering Building 4, Room 640, Extension 54169
E-mail┃ytcheng@nycu.edu.tw
Education┃Ph.D. in Electrical Engineering, University of Michigan, U.S.A
Research┃MEMS, Nanotechnology, Microsystems Integration: SOP Design and Fabrication
joint appointment Faculty
3
Office┃Engineering Building 4, Room 603, Extension 54155
E-mail┃cnkuo@nycu.edu.tw
Education┃Ph.D. in Electrical Engineering from the University of California, Los Angeles
Research┃SoC/SiP System Integration for Wireless Communication, RF/mmWave Circuit and System Design, Design of Broadband TV Tuners
joint appointment Faculty
4
Office┃Engineering Building 4, Room 401, Extension 54130
E-mail┃tzuhsien54120@nycu.edu.tw
Education┃Ph.D. in Electrical Engineering, University of Michigan, U.S.A
Research┃Broadband Communication System Design, Signal Processing and Chip Design
joint appointment Faculty
5
Office┃Engineering Building 4, Room 505, Extension 31369
E-mail┃hcchang.ee@nycu.edu.tw
Education┃Ph.D. in Electrical Engineering, National Chiao Tung University
Research┃SoC Design, Coding Theory, Signal Processing
joint appointment Faculty
6
Office ┃Engineering Building 4, Room 606, Extension 31368
E-mail┃jcguo@nycu.edu.tw
Education ┃Ph.D. in Electrical Engineering, National Chiao Tung University
Research┃Nano Devices, RF CMOS Device Modeling, High Performance Analog Device Design, Non-volatile Memory Device Design & Reliability, SoC Integration Technology
joint appointment Faculty
7
Office┃Engineering Building 4, Room 407, Extension 31626
E-mail┃hmchen@nycu.edu.tw
Education┃Ph.D. in Information Science, The University of Texas at Austin
Research┃Electronic Design Automation, Design and Analysis of Algorithms, Combinatorial Optimization
joint appointment Faculty
8
Office┃Engineering Building 4, Room 618, Extension 31685
E-mail┃cwliu@twins.ee.nctu.edu.tw
Education┃Ph.D., Institute of Electrical Engineering, National Tsing Hua University
Research┃SoC and VLSI System Design, Processor for Embedded Computing Systems, Digital Signal Processing, Digital Communications, Coding Theory
joint appointment Faculty
9
Office┃Engineering Building 4, Room 621, Extension 31372
E-mail┃jdhuang@nycu.edu.tw
Education┃Ph.D. in Electrical Engineering, National Chiao Tung University
Research┃Electronic Design Automation (EDA), Biochip Design Automation, Microprocessor Design, Silicon IP and SoC Design
joint appointment Faculty
10
Office┃Engineering Building 4, Room 406, Extension 31925
E-mail┃tschang@nycu.edu.tw
Education┃Ph.D. in Electrical Engineering, National Chiao Tung University
Research┃Digital IP Authoring, VLSI/IC Design, Signal Processing Architecture Design, Image and Video Signal Processing, Computer Architecture Design
joint appointment Faculty
11
Office┃Engineering Building 4, Room 619, Extension 31475
E-mail┃jerryjou@nycu.edu.tw
Education┃Ph.D. in Electrical Engineering, National Chiao Tung University
Research┃Digital/Mixed Signal Integrated Circuits, Communication Integrated Circuits and Systems, Computer-Aided Design
joint appointment Faculty
12
Office┃Engineering Building 4, Room 646, Extension 54193
E-mail┃hclin@nycu.edu.tw
Education┃Ph.D. in Electrical Engineering, National Chiao Tung University
Research┃Nano device fabrication and characterization, Device Reliability
joint appointment Faculty
13
Office┃Engineering Building 4, Room 408, Extension 31289
E-mail┃graylin@nycu.edu.tw
Education┃Ph.D. in Electrical Engineering, National Chiao Tung University
Research┃Quantum/Nano-structure Semiconductor Laser, Optoelectronic Device Analysis and Characterization, Molecular Beam Epitaxy
joint appointment Faculty
14
Office┃Engineering Building 4, Room 507, Extension 31605
E-mail┃genelin@nycu.edu.tw
Education┃Ph.D., Institute of Physics, Boston University, U.S.A.
Research┃First-principles Calculation of Crystal Bulks and Surfaces, Theory of Scanning Tunneling Microscopy (STM), Atomic-scale Magnetism
joint appointment Faculty
15
Office┃Engineering Building 4, Room 409, Extension 54261
E-mail┃thhou@nycu.edu.tw
Education┃Ph.D. in Electrical Engineering, Cornell University, U.S.A.
Research┃Nonvolatile Memory, Electronic Synapse and Neuromorphic Computation, Metal-oxide Thin-film Transistor, Two-dimensional Layered Materials and Devices, Nanotechnology, Semiconductor Device Physics
joint appointment Faculty
16
Office┃Engineering Building 4, Room 506, Extension 31558
E-mail┃knchen@nycu.edu.tw
Education┃Ph.D. in Department of Electrical Engineering and Information Science, Massachusetts Institute of Technology, U.S.A.
Research┃3D integrated circuits (3D IC), Heterogeneous integration, Advanced packaging
joint appointment Faculty
17
Office┃Engineering Building 4, Room 516A, Extension 54203
E-mail┃hakko@nycu.edu.tw
Education ┃Ph.D. in Electrical Engineering, University of Tokyo, Japan
Research┃Wireless Power Transmission System, Power Management Integrated Circuits, Low-power Low-voltage Integrated Circuits
joint appointment Faculty
18
Office┃Engineering Building 4, Room 617, Extension 54210
E-mail┃pwli@nycu.edu.tw
Education┃Ph.D. in Electrical Engineering, Columbia University, U.S.A.
Research┃Nano Electronics/Nano Photonics, Semiconductor Physics and Devices, IC technologies
joint appointment Faculty
19
Office┃Engineering Building 4, Room 509, Extension 54138
E-mail┃rayhua@nycu.edu.tw
Education┃Ph.D. in Electrical Engineering, National Sun Yat-sen University.
Research┃Optoelectronic Devices, Power Transistors, Epilayer Transferring Technologies, Wafer Bonding Technologies, New Generation Solar Cells, Flexible Device
joint appointment Faculty
20
Office┃Engineering Building 4, Room 536, Extension 59442
E-mail┃tlwu@nycu.edu.tw
Education┃Ph.D. of Department of Electrical Engineering, Catholic University of Louvain, Belgium
Research┃Power GaN and SiC semiconductor devices, Sub-5 nm beyond CMOS, Reliability evaluation and degradation mechanism analysis, AI-assisted device design and reliability prediction in advanced semiconductor technologies
joint appointment Faculty
21
Office┃Engineering Building 4, Room 540, Extension 31211
E-mail┃jimmyliu@nycu.edu.tw
Education┃Ph.D. in Electrical Engineering, National Chiao Tung University
Research┃EDA, Analog Behavioral Modeling, High-level Power Modeling, Verification of System-level Integration
joint appointment Faculty
22
Office┃Engineering Building 4, Room 647, Extension 54146
E-mail┃cstan@nycu.edu.tw
Education┃Ph.D. in Institute of Materials Science and Engineering, National Tsing Hua University
Research┃Semiconductor Materials Computation and Design, Component Electrical Measurement and Simulation, Quantum Dot Physical Properties and Components, Organic-Inorganic Hybrid Optoelectronic Components
joint appointment Faculty
23
Office┃Engineering Building 4, Room 609, Extension 54122
E-mail┃jeng@nycu.edu.tw
Education┃Ph.D. in Institute of Telecommunications Engineering, National Taiwan University.
Research┃Ultrasound Imaging Systems, Signal Processing, Contactless Biometric Detection, Machine-learning-based Imaging, Photoacoustic Imaging, Medical Imaging Systems
joint appointment Faculty
24
Office┃Engineering Building 4, Room 513A, Extension 54137
E-mail┃dhlien@nycu.edu.tw
Education┃Ph.D. in Electrical Engineering, National Taiwan University
Research┃Electronic materials, smart electronics, photophysics of novel semiconductors, nano electronics
joint appointment Faculty
25
Office┃Engineering Building 4, Room 502, Extension 54131
E-mail┃mltseng@nycu.edu.tw
Education┃Ph.D. in Applied Physics, National Taiwan University
Research┃Nano Components, Biomedical Optoelectronics, Ultraviolet Optoelectronics, Nanomaterials, Nano Device Mass Production, Silicon Interface, Nanoprocessing
joint appointment Faculty
26
Office┃Engineering Building 4, Room 404, Extension 54123
E-mail┃kcchen@nycu.edu.tw
Education┃Ph.D. in Electronics Engineering, National Taiwan University
Research┃Multiprocessor SoC (MPSoC) design, Neural network learning algorithm design, Reliable system design, VLSI/CAD design, Smart manufacturing
joint appointment Faculty
27
Office┃Engineering Building 4, Room 403, Extension 54289
E-mail┃yicwu@nycu.edu.tw
Education┃Ph.D. in Electrical Engineering, National Taiwan University
Research┃Digital Architecture and Circuits Design, VLSI for Biomedical Signal Processing, Hardware Acceleration for AI/ML
joint appointment Faculty
27
Office┃Engineering Building 4, Room 537, Extension 54148
E-mail┃cylin.iee@nycu.edu.tw
Education┃Ph.D. in Electrical Engineering, National Chiao Tung University
Research┃Mixed Signal IC Design, High Frequency IC Design, IC Reliability, Intelligent Bionic Circuits and Systems
joint appointment Faculty
29
Office┃Engineering Building 4, Room 836, Extension 54535
E-mail┃cchung@nycu.edu.tw
Education┃Ph.D. in Electrical Engineering, Ohio State University, USA
Research┃Analog and Mixed-Signal IC Design, Power Management IC Design, Biomedical IC Design
joint appointment Faculty
30
Office┃Engineering Building 5, Room 768, Extension 54394
E-mail┃yudoliao@nycu.edu.tw
Education┃PhD. in Electrical Engineering, University of Washington, USA
Research┃Low Power Integrated Circuits, Radio Frequency and Communication Integrated Circuits, Integrated sensors, Energy Harvesting Circuits Design, Biomedical Circuits and Systems
joint appointment Faculty
31
Office┃Engineering Building 5, Room 735, Extension 54369
E-mail┃henrytsai@nycu.edu.tw
Education ┃Ph.D. in Electrical Engineering, University of California, Davis, USA
Research ┃Micro-sensing, high-speed communication, and power management ICs and systems
joint appointment Faculty
32
Office┃Engineering Building 5, Room 730, Extension 54440
E-mail┃yuhwaitseng@g2.nctu.edu.tw
Education┃Ph.D. in Electrical Engineering, National Central University
Research┃Analog IC Design High Speed Transceiver Clock Synchronization Analog / Digital IC Testing Design for Test
joint appointment Faculty
33
Office┃Engineering Building 5, Room 767, Extension 31567
E-mail┃lennon@nycu.edu.tw
Education┃Ph.D. in Electrical Engineering, Georgia Institute of Technology, USA
Research┃Biomedical Image Processing, VLSI Architecture, Battery Management System
joint appointment Faculty
34
Office┃Engineering Building 6, Room 319, Extension 31871
E-mail┃khwei@nycu.edu.tw
Education┃Ph.D. in Chemical Engineering, University of Massachusetts
Research┃conjugated polymers, graphene, two-dimensional materials, hydrogen evolution reaction, super capacitors, quantum dots and nanoparticles nanocomposites, photovoltaics
joint appointment Faculty
35
Office┃Engineering Building 6, Room 321, Extension 31818
E-mail┃sanyuanchen@nycu.edu.tw
Education┃Ph.D. in Materials Science and Engineering, University of Michigan, USA
Research┃NanoBiomaterials, Design and Synthesis of Drug/Gene Delivery System, Nanomedicine, Bioimaging and Theranostics
joint appointment Faculty
36
Office┃Engineering Building 6, Room 310, Extension 31814
E-mail┃chihchen@nycu.edu.tw
Education┃Ph.D. in Materials Science and Engineering, University of California, Los Angeles
Research┃Electromigration and metallurgical reactions in flip-chip solder joints, 3D IC packaging, Nanotwinned Cu: fabrication and application, Low temperature Cu-to-Cu direct bonding
joint appointment Faculty
37
Office┃Engineering Building 6, Room 357, Extension 55803
E-mail┃fhko@nycu.edu.tw
Education┃Ph.D. in Atomic Science, National Tsing Hua University
Research┃nanomaterial for biosensors, functional nanomaterials, nanodevices, hybrid nanomaterial with innovative property and application, and flexible transistor and memory devices
joint appointment Faculty
38
Office┃Engineering Building 6, Room 329, Extension 55395
E-mail┃wwwu@nycu.edu.tw
Education┃Ph.D. in Materials Science and Engineering, National Tsing Hua University
Research┃Electron Microscopy, Semiconductor Materials, Nano-Optoelectronic Materials, Microelectronic Materials and Processing, Microstructural and Defect Analysis of Materials, Thin Film Engineering
joint appointment Faculty
39
Office┃Engineering Building 6, Room 306, Extension 31898
E-mail┃yctseng1978@nycu.edu.tw
Education┃Ph.D. in Materials Science and Engineering, Northwestern University, USA
Research┃spintronics, magnetic semiconductors, solid state physics, materials physics, synchrotron radiation
joint appointment Faculty
40
Office┃Science Building 3, Room 504, Extension 56106
E-mail┃yfchen@nycu.edu.tw
Education┃Ph.D. in Electrical Engineering, National Chiao Tung University
Research┃Laser Engineering, Laser Physics, Quantum-Classical Correspondence
joint appointment Faculty
41
Office┃Science Building 3, Room 514, Extension 56196
E-mail┃cwluoep@nycu.edu.tw
Education┃Ph.D. in Electrophysics, National Chiao Tung University
Research┃Ultrafast Dynamics in Strongly Correlated Quantum Matter, THz Spectroscopy and Applications, Femtosecond Laser Annealing and Machining, Time-resolved Spectroscopy
joint appointment Faculty
42
Office┃Science Building 3, Room 515, Extension 56176
E-mail┃sukuanwei@nycu.edu.tw
Education┃Ph.D. in Department of Electrophysics, National Chiao Tung University
Research┃Laser Physics and Engineering, Nonlinear Optics and Quantum Physics, High-speed Dynamics & Appl. of Light-matter Interaction, Semiconductor Optoelectronic Device, Biomedical Photonic Systems
joint appointment Faculty
43
Office┃Science Building 3, Room 402, Extension 56118
E-mail┃chihyenchen@nycu.edu.tw
Education┃Ph.D. in Department of Materials Science and Engineering, National Tsing Hua University
Research┃Fabrication, characterization and application of low-dimensional semiconductor materials, Testing and evaluation of quantum materials and devices, Net Zero Energy Technology, New Energy Alternatives of Internet of Things (IOT), Environmental Electron Microscopy
joint appointment Faculty
44
Office┃Jan Ol Biomedical. Engineering Building, Room 724, Extension 59719
E-mail┃ethanilan@nycu.edu.tw
Education┃Ph.D. in Biomedical Engineering, University of California, Los Angeles
Research┃Metabolic engineering, Synthetic biology, Renewable fuels and chemical production
joint appointment Faculty
45
Office┃Jan Ol Biomedical. Engineering Building, Room 719, Extension 59711
E-mail┃wenurea@yahoo.com.tw
Education┃Ph.D. in Biological Science and Technology, National Chiao Tung University
Research┃Oncology, Biomarkers, monoclonal antibody, Biomaterial
joint appointment Faculty
46
Office┃Jan Ol Biomedical. Engineering Building, Room 534, Extension 56982
E-mail┃mcliang@nycu.edu.tw
Education┃Ph.D. in Molecular Biology, Cell Biology and Biochemistry, Boston University
Research┃Cancer, Lung Cancer Animal Model, Molecular Medicine, Natural Products
joint appointment Faculty
47
Office┃Engineering Building 6, Room 369, Extension 58524
E-mail┃mphlin@nycu.edu.tw
Education┃Ph.D. in Electronics Engineering, National Taiwan University
Research┃Analog Circuit and Layout Synthesis Automation, Electronic Design Automation, AI chip and system-on-chip (Soc) design methodologies
joint appointment Faculty
48
Office┃Engineering Building 6, Room 371, Extension 58526
E-mail┃yjlee1976@nycu.edu.tw
Education┃Ph.D. in Electronics, National Yang Ming Chiao Tung University
Research┃Advanced nanodevices (including FinFETs, GAA FETs) and heterogeneous channel-integrated devices (Si/Ge CFETs), metal-oxide devices and stacked devices, high-k materials
joint appointment Faculty
49
Office┃Engineering Building 6, Room 370, Extension 58525
E-mail┃gcliang@nycu.edu.tw
Education┃Ph.D. in Electrical and Computer Engineering, Purdue University
Research┃Advanced materials, novel functional devices, spintronics and devices, stochastic computation and Probabilistic-bits
joint appointment Faculty
50
Office┃Engineering Building 6, Room 368, Extension 58523
E-mail┃elle1352@nycu.edu.tw
Education┃Ph.D. in International College of Semiconductor Technology, National Yang Ming Chiao Tung University
Research┃RF integrated circuit design, RF front-end subsystem integration, RF reliability analysis of semiconductor components
Off-campus Adjunct Faculty
Office┃Building F, Room 8004
Tel┃07-5252000 #4000,#4144
E-mail┃khwei@nycu.edu.tw
Education┃Ph.D. in Electrical Engineering, State University of New York at Stony Brook, U.S.A.
Research┃VLSI Design, Communication Interface Circuit Design, AI and Neural Network Design
兼任副教授
彰化師範大學化學系
開授課程┃
114-1 有機化學 Organic Chemistry
113-1 有機化學 Organic Chemistry
112-1 有機化學 Organic Chemistry
學歷┃國立清華大學化學所博士
兼任教授
晶神醫創股份有限公司副總經理
開授課程┃
114-1類比積體電路導論Introduction to Analog Integrated Circuits
113-2類比積體電路實驗Analog Integrated Circuits LAB
113-1類比積體電路導論Introduction to Analog Integrated Circuits
學歷┃國立陽明交通大學電子所博士
兼任教授
義隆電子股份有限公司處長
開授課程┃
113-2超大型積體電路設計導論Introduction to VLSI Design
學歷┃國立陽明交通大學電子所博士
兼任教授
電子所退休教師
開授課程┃
113-2半導體工程技術Semiconductor Processing Technology
學歷┃美國佛羅里達大學化學工程所博士
兼任教授
力晶積成電子製造股份有限公司資深處長
開授課程┃
114-1記憶體積體電路導論Introduction to Memory Integrated Circuits
學歷┃國立陽明交通大學電子所博士
兼任教授
台北海洋科技大學退休教師
開授課程┃
114-1先進積體電路封裝技術導論 Introduction of IC package technology
學歷┃國立陽明交通大學電子所博士
兼任教授
台灣積體電路製造股份公司經理
開授課程┃
114-1固態物理(二) Solid State Physics Ⅱ
學歷┃美國加州大學洛杉磯分校電機所博士
Staff
Retired Professor
Education┃Ph.D. in Biochemistry, Iowa State University, U.S.A.
Research┃Cell biology and mitochondrial function, interfacial technology, biosensor, biomimetic and nanobiomedial material
電工系
學歷┃美國亞歷桑那大學電機工程博士(輔修光學)
專長┃積體光學、生物光電、奈米光電
Phone|(03) 571-2121 #31654 & #31676
E-mail|nano@nycu.edu.tw
Address|300新竹市東區大學路1001號(交大光復校區)工程四館106室